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- (footprint "0805_0" (version 20211014) (generator pcbnew)
- (layer "F.Cu")
- (tedit 626993EF)
- (attr through_hole)
- (fp_text reference "R**" (at 0 1.4 180) (layer "F.SilkS")
- (effects (font (size 0.7 0.66) (thickness 0.16)))
- (tstamp 6b0b32a4-66b0-4dc7-82a5-5ca5e1e89eda)
- )
- (fp_text value "0805_0" (at -0.875 0 90) (layer "F.Fab")
- (effects (font (size 0.3 0.2) (thickness 0.05)))
- (tstamp cf977bf4-a6bf-46c5-a5c9-ca5ff76dc3b2)
- )
- (fp_line (start -0.4 0.75) (end 0.4 0.75) (layer "F.SilkS") (width 0.17) (tstamp 04201a11-489b-47bb-84c4-a164fc0425ba))
- (fp_line (start -0.4 -0.75) (end 0.4 -0.75) (layer "F.SilkS") (width 0.17) (tstamp 86f7219d-17f3-4330-9136-819ab3f80ca4))
- (pad "" smd rect (at 0 0) (size 1.255 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 882328ab-5699-4165-89ff-6c32bc15d44a))
- (pad "1" smd rect (at -0.875 0) (size 0.85 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
- (solder_mask_margin 0.07) (solder_paste_margin -0.05) (tstamp e22c56e1-b827-420d-ae49-6998a2af9a36))
- (pad "2" smd rect (at 0.875 0) (size 0.85 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
- (solder_mask_margin 0.07) (solder_paste_margin -0.05) (tstamp 5be45817-888e-4008-8212-c14a886fc97f))
- (model "${MY_PATH}/3D/R.3dshapes/0805.step"
- (offset (xyz 0 0 0))
- (scale (xyz 1 1 1))
- (rotate (xyz 0 0 0))
- )
- )
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