0805_0.kicad_mod 1.3 KB

12345678910111213141516171819202122232425
  1. (footprint "0805_0" (version 20211014) (generator pcbnew)
  2. (layer "F.Cu")
  3. (tedit 626993EF)
  4. (attr through_hole)
  5. (fp_text reference "R**" (at 0 1.4 180) (layer "F.SilkS")
  6. (effects (font (size 0.7 0.66) (thickness 0.16)))
  7. (tstamp 6b0b32a4-66b0-4dc7-82a5-5ca5e1e89eda)
  8. )
  9. (fp_text value "0805_0" (at -0.875 0 90) (layer "F.Fab")
  10. (effects (font (size 0.3 0.2) (thickness 0.05)))
  11. (tstamp cf977bf4-a6bf-46c5-a5c9-ca5ff76dc3b2)
  12. )
  13. (fp_line (start -0.4 0.75) (end 0.4 0.75) (layer "F.SilkS") (width 0.17) (tstamp 04201a11-489b-47bb-84c4-a164fc0425ba))
  14. (fp_line (start -0.4 -0.75) (end 0.4 -0.75) (layer "F.SilkS") (width 0.17) (tstamp 86f7219d-17f3-4330-9136-819ab3f80ca4))
  15. (pad "" smd rect (at 0 0) (size 1.255 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 882328ab-5699-4165-89ff-6c32bc15d44a))
  16. (pad "1" smd rect (at -0.875 0) (size 0.85 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
  17. (solder_mask_margin 0.07) (solder_paste_margin -0.05) (tstamp e22c56e1-b827-420d-ae49-6998a2af9a36))
  18. (pad "2" smd rect (at 0.875 0) (size 0.85 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
  19. (solder_mask_margin 0.07) (solder_paste_margin -0.05) (tstamp 5be45817-888e-4008-8212-c14a886fc97f))
  20. (model "${MY_PATH}/3D/R.3dshapes/0805.step"
  21. (offset (xyz 0 0 0))
  22. (scale (xyz 1 1 1))
  23. (rotate (xyz 0 0 0))
  24. )
  25. )