(footprint "0805_0" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 626993EF)
  (attr through_hole)
  (fp_text reference "R**" (at 0 1.4 180) (layer "F.SilkS")
    (effects (font (size 0.7 0.66) (thickness 0.16)))
    (tstamp 6b0b32a4-66b0-4dc7-82a5-5ca5e1e89eda)
  )
  (fp_text value "0805_0" (at -0.875 0 90) (layer "F.Fab")
    (effects (font (size 0.3 0.2) (thickness 0.05)))
    (tstamp cf977bf4-a6bf-46c5-a5c9-ca5ff76dc3b2)
  )
  (fp_line (start -0.4 0.75) (end 0.4 0.75) (layer "F.SilkS") (width 0.17) (tstamp 04201a11-489b-47bb-84c4-a164fc0425ba))
  (fp_line (start -0.4 -0.75) (end 0.4 -0.75) (layer "F.SilkS") (width 0.17) (tstamp 86f7219d-17f3-4330-9136-819ab3f80ca4))
  (pad "" smd rect (at 0 0) (size 1.255 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 882328ab-5699-4165-89ff-6c32bc15d44a))
  (pad "1" smd rect (at -0.875 0) (size 0.85 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.07) (solder_paste_margin -0.05) (tstamp e22c56e1-b827-420d-ae49-6998a2af9a36))
  (pad "2" smd rect (at 0.875 0) (size 0.85 1.5) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.07) (solder_paste_margin -0.05) (tstamp 5be45817-888e-4008-8212-c14a886fc97f))
  (model "${MY_PATH}/3D/R.3dshapes/0805.step"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)